Electronic component

ABSTRACT

An electronic component includes an element body, a thin film layer disposed to cover a pair of end surfaces and four side surfaces, a first external electrode and a second external electrode, and internal conductors, wherein each of the first external electrode and the second external electrode has first electrode layers disposed on the thin film layer and electrically connected to the internal conductors, and second electrode layers disposed to cover the first electrode layers, and a thermal conductivity of the second electrode layers is lower than a thermal conductivity of the first electrode layers.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application is a continuation of U.S. application Ser. No.16/134,733 filed Sep. 18, 2018, which is based on and claims priorityunder 35 U.S.C. 119 from Japanese Patent Application No. 2017-188313filed on Sep. 28, 2017. The contents of the above applications areincorporated herein by reference.

TECHNICAL FIELD

An aspect of the present invention relates to an electronic component.

BACKGROUND

An electronic component including an element body having a pair of endsurfaces facing each other and four side surfaces connecting the pair ofend surfaces and formed of a ceramic, and a first external electrode anda second external electrode respectively disposed on the side of thepair of end surfaces of the element body is known (for example, refer toPCT International Publication No WO 2016/084457).

SUMMARY

When an electronic component is mounted on a circuit board or the like,heat (board heat, resistance heat) generated in the circuit board may betransferred to the element body via the external electrode.Characteristics of the electronic component may deteriorate when heat istransferred to the element body (functional part). Therefore,reliability of the electronic component may be lowered.

One aspect of the present invention is to provide an electroniccomponent capable of curbing deterioration of reliability.

An electronic component according to one aspect of the present inventionincludes an element body having a pair of end surfaces which face eachother and four side surfaces which connect the pair of end surfaces andformed of a semiconductor ceramic, a thin film layer disposed to coverthe pair of end surfaces and the four side surfaces and having anelectrical insulation property, a first external electrode and a secondexternal electrode disposed on a side of each of the pair of endsurfaces, and an internal conductor disposed in the element body,wherein the thin film layer is formed along a surface shape of each ofthe pair of end surfaces and the four side surfaces, each of the firstexternal electrode and the second external electrode has a firstelectrode layer disposed on the thin film layer and electricallyconnected to the internal conductor, and a second electrode layerdisposed to cover the first electrode layer, and a thermal conductivityof the second electrode layer is lower than a thermal conductivity ofthe first electrode layer.

In the electronic component according to one aspect of the presentinvention, the second electrode layer is disposed to cover the firstelectrode layer. The thermal conductivity of the second electrode layeris lower than the thermal conductivity of the first electrode layer.Therefore, when an electronic component is mounted on a circuit board orthe like, transmission of heat generated in the circuit board or thelike to the element body can be suppressed. The outer surface of theelement body is covered with a thin film layer. Accordingly, in anelectronic component, transfer of heat generated in a circuit board orthe like to the element body can be suppressed. Therefore, deteriorationin characteristics of electronic components due to heat generated in acircuit board or the like can be minimized. As a result, deteriorationin reliability of electronic components can be minimized.

In the electronic component, the thin film layer is formed along therespective surface shapes of the pair of end surfaces and the four sidefaces. An outer surface of the element body may be concavo-convex.Therefore, a surface area of the thin film layer can increase and ananchoring effect can be obtained by forming the thin film layer alongthe surface shape of the outer surface of the element body. Therefore,adhesion between the thin film layer and the first electrode layer andthe second electrode layer can be improved. Therefore, in the electroniccomponent, since bonding strength between the thin film layer and thefirst electrode layer and the second electrode layer can be secured,separation of the first electrode layer and the second electrode layertherefrom can be prevented. As a result, in the electronic component, itis possible to minimize deterioration in reliability.

In one embodiment, a thickness of the thin film layer disposed on thefour side surfaces may be larger than a thickness of the thin film layerdisposed on the pair of end surfaces. In this configuration, since thethickness of the thin film layer disposed on the four side surfaces islarge, it is possible to prevent the heat from being transferred to theelement body from the four side surfaces. Also, since the thickness ofthe thin film layer disposed on the end surface is relatively small(thin), an internal conductor drawn to the end surface is able to breakthrough the thin film layer and be exposed from the thin film layer.Therefore, it is possible to ensure electrical connection between eachof the first external electrode and the second external electrode andthe internal conductor.

In one embodiment, the thin film layer may have a thickness of 50 nm ormore and 300 nm or less.

According to one aspect of the present invention, it is possible to curbdeterioration of reliability.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1 is a perspective view showing an electronic component accordingto one embodiment.

FIG. 2 is an exploded perspective view of an element body.

FIG. 3 is a diagram showing a cross-sectional configuration of theelectronic component.

FIG. 4 is a diagram showing the cross-sectional configuration of theelectronic component.

FIG. 5 is an enlarged cross-sectional view showing a surface of theelement body and a thin film layer.

DETAILED DESCRIPTION

Hereinafter, preferable embodiments of the present invention will bedescribed in detail with reference to the accompanying drawings. In thedrawings, the same or similar elements are designated by the samereference numerals, and repeated description will be omitted.

As shown in FIG. 1, an NTC thermistor (electronic component) 1 includesan element body 2, and a first external electrode 3 and a secondexternal electrode 4 disposed on an outer surface of the element body 2.

The element body 2 has a rectangular parallelepiped shape. Therectangular parallelepiped shape includes a rectangular parallelepipedshape in which a corner portion and a ridge portion are chamfered, and arectangular parallelepiped shape in which a corner portion and a ridgeportion are rounded. The element body 2 includes a pair of end surfaces2 a and 2 b facing each other, a pair of main surfaces (side surfaces) 2c and 2 d facing each other, and a pair of side surfaces 2 e and 2 ffacing each other, as outer surfaces thereof. A facing direction inwhich the pair of main surfaces 2 c and 2 d face each other is a firstdirection D1. A facing direction in which the pair of end surfaces 2 aand 2 b face each other is a second direction D2. A facing direction inwhich the pair of side surfaces 2 e and 2 f face each other is a thirddirection D3. In the embodiment, the first direction D1 is a heightdirection of the element body 2. The second direction D2 is alongitudinal direction of the element body 2 and is orthogonal to thefirst direction D1. The third direction D3 is a width direction of theelement body 2 and is orthogonal to the first direction D1 and thesecond direction D2.

The pair of end surfaces 2 a and 2 b extend in the first direction D1and perform connection between the pair of main surfaces 2 c and 2 d.The pair of end surfaces 2 a and 2 b also extends in the third directionD 3 (a short side direction of the pair of main surfaces 2 c and 2 d).The pair of side surfaces 2 e and 2 f extend in the first direction D1to connect a space between the pair of main surfaces 2 c and 2 d. Thepair of side surfaces 2 e and 2 f also extends in the second directionD2 (a long side direction of the pair of end surfaces 2 a and 2 b). Inthe embodiment, any one of the pair of main surfaces 2 c and 2 d isdefined as a mounting surface facing another electronic device when theNTC thermistor 1 is mounted on another electronic device (for example, acircuit board, an electronic component or the like).

As shown in FIG. 2, the element body 2 is formed by stacking a pluralityof thermistor layers 7 in a direction in which the pair of main surfaces2 c and 2 d face each other. In the element body 2, a stacking directionof the plurality of thermistor layers 7 coincides with the firstdirection D1. Each of the thermistor layers 7 may be made of, forexample, a semiconductor ceramic containing Mn, Ni and Co metal oxidesas main components. The thermistor layers 7 may contain Fe, Cu, Al, Zror the like as auxiliary components for allowing properties thereof tobe adjusted (such as rate of change in resistance) in addition to eachof Mn, Ni and Co metal oxides as main components. The thermistor layers7 may be formed of Mn and Ni metal oxides or Mn and Co metal oxidesinstead of each of Mn, Ni and Co metal oxides. In the actual elementbody 2, each of the thermistor layers 7 is integrated to such an extentthat a boundary between the thermistor layers 7 cannot be visuallyrecognized.

A thin film layer 10 is disposed on an outer surface of the element body2. The thin film layer 10 is disposed on the pair of end surfaces 2 aand 2 b, the pair of main surfaces 2 c and 2 d, and the pair of sidesurfaces 2 e and 2 f. That is, the thin film layer 10 is disposed tocover the entire outer surface of the element body 2. The thin filmlayer 10 is a glass layer having an electrical insulation property.Specifically, the thin film layer 10 is an amorphous glass coatinglayer. The thin film layer 10 is formed of a glass material such assilica glass and may include Al and Li. Crystallized glass is not usedas the material of the thin film layer 10.

A thickness of the thin film layer 10 is 50 nm or more and 300 nm orless. As shown in FIGS. 3 and 4, a thickness T1 of the thin film layer10 disposed on the pair of end surfaces 2 a and 2 b is smaller than athickness T2 of the thin film layer 10 disposed on the pair of mainsurfaces 2 c and 2 d and the pair of side surfaces 2 e and 2 f (T1<T2).In other words, the thickness T2 of the thin film layer 10 disposed onthe pair of main surfaces 2 c and 2 d and the pair of side surfaces 2 eand 2 f is larger than the thickness T1 of the thin film layer 10disposed on the pair of end surfaces 2 a and 2 b. The thickness T1 is,for example, 50 nm. The thickness T2 is, for example, 80 nm.

The thin film layer 10 is formed along each surface shape of the pair ofend surfaces 2 a and 2 b, the pair of main surfaces 2 c and 2 d, and thepair of side surfaces 2 e and 2 f of the element body 2. The thin filmlayer 10 reflects the surface shapes of the pair of end surfaces 2 a and2 b, the pair of main surfaces 2 c and 2 d and the pair of side surfaces2 e and 2 f of the element body 2. That is, in a cross section shown inFIG. 5, a surface shape of the thin film layer 10 is the same as thesurface shape of each of the pair of end surfaces 2 a and 2 b, the pairof main surfaces 2 c and 2 d, and the pair of side surfaces 2 e and 2 fof the element body 2.

As shown in FIG. 5, for example, when the surface shape of the mainsurface 2 c has a concavo-convex shape, the thin film layer 10 is formedalong irregularities of the main surface 2 c (or by reflecting theirregularities). In other words, the thin film layer 10 is formed on themain surface 2 c to have substantially a uniform thickness with respectto the main surface 2 c. The thin film layer 10 is formed by, forexample, a sputtering method. The thin film layer 10 may be formed byCVD, PVD or the like.

As shown in FIG. 2, the NTC thermistor 1 includes a plurality of firstinternal electrodes 5 and a plurality of second internal electrodes 6 asinternal conductors disposed inside the element body 2. In theembodiment, the number (three in the embodiment) of the plurality offirst internal electrodes 5 is the same as the number of the pluralityof second internal electrodes 6. Each of the plurality of first internalelectrodes 5 is exposed on the end surface 2 a. Each of the plurality ofsecond internal electrodes 6 is exposed on the end surface 2 b.

The first internal electrode 5 and the second internal electrode 6 aredisposed at different positions (layers) in the first direction D1 ofthe element body 2. The first internal electrode 5 and the secondinternal electrode 6 are alternately disposed in the element body 2 toface each other with an interval therebetween in the first direction D1.

As shown in FIG. 1, the first external electrode 3 is disposed on theside of one end surface 2 a. The first external electrode 3 is formed onfive surfaces of one end surface 2 a, the pair of main surfaces 2 c and2 d, and the pair of side surfaces 2 e and 2 f. The first internalelectrode 5 is directly connected to the first external electrode 3.

The first external electrode 3 includes a first electrode layer 20, asecond electrode layer 21, a first plating layer 22, and a secondplating layer 23.

The first electrode layer 20 is disposed on the thin film layer 10. Thefirst electrode layer 20 is disposed on one end surface 2 a of theelement body 2. The first electrode layer 20 may be disposed at edgeportions of the pair of main surfaces 2 c and 2 d and the pair of sidesurfaces 2 e and 2 f on the side of the end surface 2 a. The firstelectrode layer 20 is disposed to cover the first internal electrode 5exposed on the end surface 2 a (exposed from the thin film layer 10).

The first electrode layer 20 is formed by applying a conductive paste tothe surface of the element body 2 (one end surface 2 a in theembodiment) and baking the conductive paste. The first electrode layer20 is a sintered metal layer formed by sintering a metal component(metal powder) contained in the conductive paste. In the embodiment, thefirst electrode layer 20 is a sintered metal layer formed of Ag. Thefirst electrode layer 20 may be a sintered metal layer formed of Pd. Apowder composed of Ag or Pd mixed with a glass component, an organicbinder, and an organic solvent is used as the conductive paste.

The first electrode layer 20 is electrically connected to the firstinternal electrode 5. When the first electrode layer 20 is formed bybaking the conductive paste, the first internal electrode 5 exposed onthe end surface 2 a breaks through the thin film layer 10. At this time,the conductive paste is sintered while the first internal electrode 5exposed from the thin film layer 10 and the conductive paste are incontact with each other. Accordingly, the first electrode layer 20 iselectrically connected to the first internal electrode 5.

The second electrode layer 21 is disposed to cover the first electrodelayer 20. The second electrode layer 21 is formed on five surfaces ofone end surface 2 a, the pair of main surfaces 2 c and 2 d, and the pairof side surfaces 2 e and 2 f. That is, an edge of the second electrodelayer 21 is disposed on the thin film layer 10.

The second electrode layer 21 is a conductive resin layer. Athermosetting resin mixed with a conductive material and an organicsolvent or the like is used as the conductive resin. For example, ametal powder is used as the conductive material. For example, Ag powderis used as the metal powder. For example, a phenol resin, an acrylicresin, a silicone resin, an epoxy resin, or a polyimide resin is used asthe thermosetting resin. In the second electrode layer 21, a thicknessof a central portion in the first direction D1 of the element body 2 maybe larger than a thickness on the side of the pair of main surfaces 2 cand 2 d and a thickness on the side of the pair of side surfaces 2 e and2 f.

A thermal conductivity of the second electrode layer 21 is lower than athermal conductivity of the first electrode layer 20. In other words,the thermal conductivity of the first electrode layer 20 is higher thanthe thermal conductivity of the second electrode layer 21. For example,the thermal conductivity of the first electrode layer 20 is about 10 to80 times the thermal conductivity of the second electrode layer 21.

The first plating layer 22 is disposed to cover the second electrodelayer 21. The first plating layer 22 is formed on five surfaces of oneend surface 2 a, the pair of main surfaces 2 c and 2 d, and the pair ofside surfaces 2 e and 2 f. That is, an edge of the first plating layer22 is disposed on the thin film layer 10. The first plating layer 22 isa Ni plating layer formed by Ni plating.

The second plating layer 23 is disposed to cover the first plating layer22. The second plating layer 23 is formed on five surfaces of one endsurface 2 a, the pair of main surfaces 2 c and 2 d, and the pair of sidesurfaces 2 e and 2 f. That is, an edge of the second plating layer 23 isdisposed on the thin film layer 10. The second plating layer 23 is a Snplating layer formed by Sn plating.

As shown in FIG. 1, the second external electrode 4 is disposed on theside of the other end surface 2 b. The second external electrode 4 isformed on five surfaces of one end surface 2 b, the pair of mainsurfaces 2 c and 2 d, and the pair of side surfaces 2 e and 2 f. Thesecond internal electrode 6 is directly connected to the second externalelectrode 4.

The second external electrode 4 includes a first electrode layer 30, asecond electrode layer 31, a first plating layer 32, and a secondplating layer 33.

The first electrode layer 30 is disposed on one end surface 2 b of theelement body 2. The first electrode layer 30 is electrically connectedto the second internal electrode 6. The first electrode layer 30 isformed of the same material as the first electrode layer 20.

The second electrode layer 31 is disposed to cover the first electrodelayer 30. The second electrode layer 31 is formed on five surfaces ofone end surface 2 b, the pair of main surfaces 2 c and 2 d, and the pairof side surfaces 2 e and 2 f. The second electrode layer 31 is formed ofthe same material as the second electrode layer 21.

The first plating layer 32 is disposed to cover the second electrodelayer 31. The first plating layer 32 is formed on five surfaces of oneend surface 2 b, the pair of main surfaces 2 c and 2 d, and the pair ofside surfaces 2 e and 2 f. The first plating layer 32 is formed of thesame material as the first plating layer 22.

The second plating layer 33 is disposed to cover the first plating layer32. The second plating layer 33 is formed on five surfaces of one endsurface 2 b, the pair of main surfaces 2 c and 2 d, and the pair of sidesurfaces 2 e and 2 f. The second plating layer 33 is formed of the samematerial as the second plating layer 23.

As described above, in the NTC thermistor 1 according to the embodiment,the second electrode layer 21 (the second electrode layer 31) of thefirst external electrode 3 (the second external electrode 4) is disposedto cover the first electrode layer 20 (the first electrode layer 30). Athermal conductivity of the second electrode layer 21 (the secondelectrode layer 31) is lower than a thermal conductivity of the firstelectrode layer 20 (the first electrode layer 30). Therefore, when theNTC thermistor 1 is mounted on a circuit board or the like, heatgenerated in the circuit board or the like can be suppressed from beingtransferred to the element body 2. Also, the outer surface of theelement body 2 is covered with the thin film layer 10. Thus, in the NTCthermistor 1, the heat generated in the circuit board or the like can besuppressed from being transferred to the element body 2. Accordingly,the NTC thermistor 1 can minimize deterioration of characteristics dueto the heat generated in the circuit board or the like. As a result, inthe NTC thermistor 1, it is possible to minimize deterioration inreliability. Therefore, the NTC thermistor 1 can accurately detect anambient temperature without being affected by the heat of the circuitboard or the like.

In the NTC thermistor 1 according to the embodiment, the thin film layer10 is formed along the respective surface shapes of the pair of endsurfaces 2 a and 2 b, the pair of main surfaces 2 c and 2 d, and thepair of side surfaces 2 e and 2 f. The outer surface of the element body2 may be concavo-convex. Therefore, a surface area of the thin filmlayer 10 can increase and an anchoring effect can be obtained by formingthe thin film layer 10 along the surface shape of the outer surface ofthe element body 2. Therefore, adhesion between the thin film layer 10and the first electrode layer 20 and the second electrode layer 21 (thefirst electrode layer 30 and the second electrode layer 31) can beimproved. Thus, since the NTC thermistor 1 can secure bonding strengthbetween the thin film layer 10 and the first electrode layer 20 and thesecond electrode layer 21 (the first electrode layer 30 and the secondelectrode layer 31), separation of the first electrode layer 20 and thesecond electrode layer 21 (the first electrode layer 30 and the secondelectrode layer 31) can be minimized. As a result, in the NTC thermistor1, it is possible to minimize deterioration in reliability.

In the NTC thermistor 1 according to the embodiment, the thickness T2 ofthe thin film layer 10 disposed on the pair of main surfaces 2 c and 2 dand the pair of side surfaces 2 e and 2 f is larger than the thicknessT1 of the thin film layer 10 disposed on the pair of end surfaces 2 aand 2 b. In this configuration, since the thickness of the thin filmlayer 10 disposed on the pair of main surfaces 2 c and 2 d and the pairof side surfaces 2 e and 2 f is large, it is possible to prevent heatfrom being transferred from the pair of main surfaces 2 c and 2 d andthe pair of side surfaces 2 e and 2 f into the element body 2. Further,since the thickness of the thin film layer 10 disposed on the pair ofend surfaces 2 a and 2 b is relatively small (thin), the first internalelectrode 5 withdrawn to the end surfaces 2 a and 2 b and the secondinternal electrode 6 withdrawn to the end surface 2 b breaks through thethin film layer 10 and are exposed from the thin film layer 10.Therefore, electrical connection between the first external electrode 3and the second external electrode 4 and the first internal electrode 5and the second internal electrode 6 can be ensured.

In the NTC thermistor 1 according to the embodiment, the thin film layer10 is formed of amorphous glass. For example, when the thin film layer10 is formed of crystallized glass, it is difficult to form the thinfilm layer 10 along the surface shape of the outer surface of theelement body 2, and the surface of the thin film layer 10 may be smooth(flat). In this case, the adhesion between the thin film layer 10 andthe first electrode layer 20 and the second electrode layer 21 (thefirst electrode layer 30 and the second electrode layer 31) cannot beensured. On the other hand, when the thin film layer 10 is formed ofamorphous glass, it is possible to form the thin film layer 10 along thesurface shape of the outer surface of the element body 2. Thus, in theNTC thermistor 1, the surface area of the thin film layer 10 canincrease and an anchoring effect can be obtained. Therefore, in the NTCthermistor 1, the adhesion between the thin film layer 10 and the firstelectrode layer 20 and the second electrode layer 21 (the firstelectrode layer 30 and the second electrode layer 31) can be improved.

The element body 2 is formed of a semiconductor ceramic. Therefore, whenthe first plating layer 22 and the second plating layer 23 of the firstexternal electrode 3 and the first plating layer 32 and the secondplating layer 33 of the second external electrode 4 are formed, theplating may extend from the element body 2 and the plating may be formedat an undesired place on the element body 2. In the NTC thermistor 1according to the embodiment, the thin film layer 10 is formed on theouter surface of the element body 2. Therefore, formation of a platinglayer at an undesired place on the element body 2 can be avoided.

Although the embodiment of the present invention have been describedabove, the present invention is not necessarily limited to theabove-described embodiment, and various modifications are possiblewithout departing from the gist thereof.

In the above-described embodiment, an example in which the electroniccomponent is the NTC thermistor 1 has been described. However, theelectronic component may be a varistor, a PTC thermistor or the like.When the electronic component is a varistor, the semiconductor ceramiccontains, for example, ZnO (zinc oxide) as a main component, and metalelements such as Co, rare earth metal elements, Group IIIb elements (B,Al, Ga, In), Si, Cr, Mo, alkali metal elements (K, Rb, Cs), alkalineearth metal elements (Mg, Ca, Sr, Ba), or the like, and oxides thereofmay be contained as accessory components.

In the above-described embodiment, an example in which three firstinternal electrodes 5 and three second internal electrodes 6 aredisposed has been described. However, the number of internal electrodes(internal conductors) may be appropriately set according to the design.

The shapes of the first external electrode 3 and the second externalelectrode 4 may be appropriately set according to the design.

What is claimed is:
 1. An electronic component comprising: an elementbody formed of a ceramic; an external electrode disposed on an outersurface of the element body; and an internal conductor disposed in theelement body, wherein the external electrode has a first electrode layerelectrically connected to the internal conductor, a second electrodelayer disposed to cover the first electrode layer, and a third electrodelayer disposed to cover the second electrode layer, and a thermalconductivity of the second electrode layer is lower than a thermalconductivity of the first electrode layer.
 2. The electronic componentaccording to claim 1, wherein a thermal conductivity of the thirdelectrode layer is lower than a thermal conductivity of the firstelectrode layer.
 3. The electronic component according to claim 1,wherein the first electrode layer and the second electrode layer containan identical metal component.
 4. The electronic component according toclaim 1, wherein the first electrode layer and the second electrodelayer are formed of different metal materials, and the second electrodelayer contains Ag.
 5. The electronic component according to claim 1,wherein the second electrode layer contains an identical metal componentwith respect to that of the first electrode layer and is formed of anon-identical metal component with respect to that of the thirdcomponent.
 6. The electronic component according to claim 1, furthercomprising: a thin film layer disposed on the outer surface of theelement body.
 7. The electronic component according to claim 6, whereinthe thin film layer is formed of an amorphous glass coat.
 8. Theelectronic component according to claim 6, wherein the thin film layercontains Al.
 9. The electronic component according to claim 6, whereinthe thin film layer is formed along a surface shape of the outer surfaceof the element body.
 10. The electronic component according to claim 1,wherein the element body has a pair of end surfaces facing each otherand four side surfaces connecting the pair of end surfaces, the outerelectrode is disposed near each of the pair of end surfaces, and thefirst electrode layer has a thickness of a central portion that issmaller than a thickness of an end portion when viewed from a facingdirection of the pair of end surfaces.
 11. The electronic componentaccording to claim 1, wherein the element body has a pair of endsurfaces facing each other and four side surfaces connecting the pair ofend surfaces, the outer electrode is disposed near each of the pair ofend surfaces, and the second electrode layer has a thickness of acentral portion that is larger than a thickness of an end portion whenviewed from a facing direction of the pair of end surfaces.
 12. Anelectronic device comprising: an electronic component according to claim1.